| | AC 220V±10％ 50/60Hz |
| Total power | 7600W |
| Heater power | Upper temp.zone 1200W,second temp.zone 1200W,IR temp.zone 5000W |
| Electrical material | High sensitive touch screen+temperature control module+PLC+step driver |
| Temperature controlling | High precision K shape sensor(Closed Loop),up and down independent temperature heating zone,Precision can reach±2℃ |
| Locating way | V shape holder&universal jigs |
| PCB size | Max610×500mm Min 10×10 mm |
| Applicable chips | Max90×90mm Min 0.3×0.6mm |
| PCB thickness | 0.5-8mm |
| Mounting precision | |
| | L780*W980*H950mm(without frame) |
| Thermo-couple Ports | 5 pcs |
| Weight of machine | |
| | Optical lens+HD industrial camera |
Main Features
1. Hot air head and mounting head integration design, with auto soldering and desoldering functions.
2. Independent 3 heaters, upper and lower heaters can realize move synchronously and automatically,can reach IR every position.Lower heater zone can remove up and down,support PCB board. bottom pre-heating area along X/Y axis. Lower heater can move up/down and support PCB,auto-controlled by motors. It can realize the upper and lower heater able to move towards target BGA, without moving PCB.
3. PCB board adopts high accuracy slider to make sure the mount precision of BGA and PCB.
4. Unique bottom preheating table made of Germany-imported good quality heating materials plated IR tube & constant temperature glass anti-dazzle (heat-resist up to 1800 C), pre-heating area up to 500*420mm.
5. Preheating table, clamping device and cooling system can move integrally in X axis that make PCB locating & desoldering safer and conveniently.
6. X and Y axis adopt motor automatic control moving way to make the alignment faster and more convenient,make the most use of the equipment space,realization of repairing large area PCB with a smaller volume of equipment.The Max.plate size can reach 650*610mm,no repair dead corner.
7. Double rocker control the camera and upper and lower heating platform to make sure the alignment precision accuracy.
8. Inbuilt vacuum pump, rotate 360 in angel; fine-adjusting mounting suction nozzle.
9. Suction nozzle can detect BGA pickup and mounting height automatically with pressure controllable within 10 grams; zero pressure available to smaller BGA pickup and mounting.
10. With 10 segments of temperature up (down) and 10 segments of constant temperature control,can save many segments of temperature.analyze the temperature parameter curves on the touch screen.
11. Many sizes of alloy nozzle, easy for replacement; can locate at all angle.
12. With 5 thermocouple ports, can real-time detect and analyze temperatures at multipoint.
13. With a solid operation display function to make the temperature control more reliable.
14. It can generate SMT standard temperature removing curve automatically in different regions and different environment temperature,don’t need to set curves manually, anybody can use it even without experience, realize machine intelligence.
15. With the camera that can observe the melting point of solder side, it is convenient to determine the curve (this feature is optional items).
